JUNE
2009 Meeting Announcement
Date: Monday, June 8, 2009
Registration: 5:30 P.M.
Early Bird: 6:00 P.M. Annual Section Survey Results
Dinner: 6:30 P.M.
Main
Program: 7:30 P.M. The Use of DOE Techniques for Optimizing the Wire Bonding
Process
Cost: $20.00 per person
Location:
(Fairgrounds Square Mall)
Reading, PA 19605
610-685-4000
This
meeting members of the International Microelectronics and Packaging Society
(IMAPS) will be our guests.
Menu
Buffet which
includes:
·
Tossed Garden
Salad
·
Salad Dressings
& Trimmings
·
Cole Slaw
·
Fresh Fruit Bowl
·
Potato Salad
·
Honey Glazed
Roast Chicken
·
Oven Baked
lasagna
·
New England Style
Haddock
·
Parslied New Red
potatoes
·
Vegetable du jour
·
Hot Rolls &
Butter
·
Carrot Cake
·
Coffee, Hot Tea,
& Ice Tea
·
Adult Beverages -
cash bar
Early Bird Presentation:
Frank Yurick, Section Membership Chairman, will review the
Section’s Annual Survey results. Other
items of importance to the section will also be discussed.
Main Program:
The Use of DOE Techniques for
Optimizing the Wire Bonding Process
Abstract
Wire bonding remains the dominant chip
interconnect method, with more than 90% of the chip interconnect market place. The ultrasonic weld produced by wire bonding has proven to
be a highly reliable and versatile form of interconnection, and the process has
continuously evolved to meet the demands of increasingly complex devices.
This presentation will focus on the process
variables and the use of Designed Experiments to understand the process.
Agenda:
·
Wire bonding
process variables
·
Testing wire
bonds and response variables
·
The use of
Designed Experiments to understand a complex process with 4 case studies
·
Experiments for
high yield processes
·
Analysis methods
o
DOE Analysis
o
Pareto diagrams
o
Control charts
for high yield processes
Qualifications
Lee Levine is an
internationally recognized semiconductor assembly process
expert with over 25 years of targeted experience in technical process
development and optimization. He is known
for keen analytical and troubleshooting skills in the creative and effective
resolution of problems in production processes.
He consistently produces business results that create enhanced revenue
opportunities, higher yields and trouble free operations.
Experience
Previous experience includes 20 years as Principal and
Staff Metallurgical Process Engineer at Kulicke & Soffa and Distinguished
Member of the Technical Staff at Agere Systems. He was awarded 4 patents,
published more than 50 technical papers, and won the 1999 John A. Wagnon
Technical Achievement award from the International Microelectronics and
Packaging Society, IMAPS. Major
innovations include copper ball bonding, loop shapes for thin, small outline packages
(TSOP and TSSOP, and CSPs) and introduction of DOE and statistical techniques
for understanding assembly processes. He
is a Fellow, V.P of the Keystone Chapter, and V.P Technology for IMAPS.
Lee
is a graduate of Lehigh University, Bethlehem, Pa where he earned a degree in
Metallurgy and Materials Engineering.
Reservations: Call Cori Monighan
at 610-582-2222 (Beacon Container) by Friday, June 5, 2009 to make your
reservation or e-mail her at c.monighan@beaconcontainer.com. Please leave your name, meal choice, and
company affiliation.
Please
remember that we are a non-profit organization.
Have the courtesy to cancel your reservation or you will be billed for
the meal. If you must cancel, call Cori
before Noon, on the day of the meeting.
Your cooperation is greatly appreciated.